American Chemical Society Journal Publishes New Article from Dr. Park

The American Chemical Society has published a new article co-authored by Dr. Sunggook Park in the latest issue of of ACS Applied Bio Materials. The article, "TFundamental Insights into Copper-Epoxy Interfaces for High-Frequency Chip-to-Chip Interconnects", was co-authored by Junghyun Park, Monsuru Dauda, Mustapha Bello, Ignace Agbadan, Anthony Christian Engler, Jaimal M. Williamson, Varughese Mathew, Sunggook Park, and John C. Flake.

The research conducted at Louisiana State University investigates the viability of thin cuperic oxide interconnects as compared to adhesion promotion with cuperic oxides and thick cuperous oxide interconnects. Ensuring the durability of these bonds is vital to the development of future, higher-frequency multi-chip packages.

The abstract and full text can be viewed on the ACS wesbite.